Welcome: FeedLiTech
Language: Chinese ∷  English



In 2019, Huawei's HiSilicon packaging and testing supply chain will return, and my country's packaging and testing industry will be thriving. The Institute of Semiconductors estimates that the packaging and testing industry will achieve a growth of about 16%.

In 2019, many of our packaging and testing projects will be completed. In 2020, my country's packaging and testing production capacity will be further increased, which is bound to drive further expansion of the packaging and testing scale.

At present, domestic FOPLP packaging, high-performance RF packaging and Chiplet technologies have completed the layout. With the further return of Huawei HiSilicon packaging and testing supply chain, my country's packaging and testing technology will be further improved.

With the improvement of packaging technology, professional third-party testing will develop rapidly.

Let's take a look at what people in the packaging industry say.

Huang Mian, General Manager of Shenzhen Zhongke Sihe Technology Co., Ltd.

Wang Xinchao Chairman of Jiangsu Xinchao Technology Group Co., Ltd.

Xu Linhua, Executive Deputy General Manager of Ningbo Silicon Electronics (Ningbo) Co., Ltd.

Yu Daquan President of Xiamen Yuntian Semiconductor Technology Co., Ltd.

Zhang Yifeng CEO of Guangdong Liyang Chip Testing Co., Ltd.

Huang Mian, General Manager of Zhongke Sihe

Huang Mian, General Manager of Shenzhen Zhongke Sihe Technology Co., Ltd.

2019 is the year that the board-level fan-out packaging process began to enter the application in batches, and it is also a year of great strides for Zhongke Sihe.
Zhongke Sihe is committed to building a fan-out packaging process manufacturing platform for board-level discrete devices, and conducts research on advanced fan-out packaging technology and discrete device/module products based on this platform. After four years of research and development, Zhongke Sihe has completed the development and mass production of low-pin-count discrete device board-level fan-out packaging technology. In Q4 of 2019, the monthly production capacity of DFN package products reached 180KK, and the mass production package size covers DFN0603, DFN1006, DFN2510, DFN3x3, etc., product reliability meets the automotive-grade AEC-Q101 standard, mass-produced product types cover TVS devices, Schottky diodes, etc., currently single-chip and multi-chip integrated MOSFET products, power modules, GaN modules, etc. The product is under development.
In 2020, the Zhongke Quad will continue to increase the mass production capacity of the board-level fan-out packaging process. The DFN packaging capacity will achieve a monthly capacity of over 300KK in Q3 of 2020, and the mass production product type will be expanded from diode products to The MOSFET product line has to achieve a small target of 100 million yuan in operating income.
Based on the strategic cooperation between the Institute of Microelectronics of the Chinese Academy of Sciences and Shennan Circuits, Shenzhen Zhongke Sihe Technology Co., Ltd. (hereinafter referred to as Zhongke Sihe) was established in 2014 and is headquartered in Shenzhen. It is currently a national high-tech enterprise and Shenzhen High-tech Technology companies. One of the founding shareholders of Guangdong Semiconductor Intelligent Equipment and System Integration Innovation Center.

Wang Xinchao Chairman of Xinchao Group

Wang Xinchao, Chairman of Jiangsu Xinchao Technology Group Co., Ltd.

2019 is about to pass, and a new era is coming. These years have been an exciting time for the development of China’s semiconductor industry. Not only is the state and society’s new round of large-scale support and investment in the semiconductor industry, but the turbulent international situation has made 19 years and the new era facing The global semiconductor industry is full of unprecedented opportunities and challenges.
In these days of leaving the old and welcoming the new, looking back on 2019, the semiconductor industry has two themes: one is the comprehensive and rapid rise of the domestic semiconductor industry chain; the other is the arrival of the 5G era. Following the ZTE incident, the United States again swept the sanctions against Huawei, the benchmark of China's high-tech industry in 2019. But this time produced a completely different result-not only did Huawei not fall, but it also aroused the attention of the whole society on semiconductors, which in turn made the entire semiconductor industry chain of my country boil. The newly opened sci-tech innovation board has become the main show ground for the first up-and-coming semiconductor companies. Starting from the design company, it has promoted the comprehensive revival of the domestic industrial chain from top to bottom, and each link of the industrial chain has obtained unprecedented opportunities and development. But looking at the world, under the situation of increasing trade protectionism, the global economic growth is weak and crises are everywhere. The smartphone market continues to be in a sluggish trend. According to data released by many market research institutions, the global mobile phone market did not get rid of the curse of decline in the first three quarters. A slight decline in the mobile phone market throughout the year should be a high probability event. Affected by this, the global semiconductor industry suffered a sharp decline in the first half of 2019. The overall rebound in the second half of the year driven by 5G may bring the whole year back to the positive growth range. For this year's semiconductor industry, the contribution of 5G is indispensable. The major operators are fully deploying their networks, and the flagship products of major mobile phone chip suppliers are fully 5G, which injects a strong needle into the previously sluggish semiconductor industry.
Looking forward to 2020, 5G will continue to penetrate into the mainstream of mid-to-high-end mobile phones, bringing a new wave of phone replacements. At the same time, 5G's demand for high-performance RF and power management chips has soared, and its promotion of the semiconductor industry has become broader, especially the business opportunities that it brings to companies in the analog and RF-related fields cannot be ignored. As a result, new requirements have also been put forward for each link of semiconductor equipment, materials, manufacturing, and packaging and testing. In addition to 5G, artificial intelligence (AI) will continue to develop. From the intelligent manufacturing of industrial production, to the assistance of people in all aspects of social life, to the new applications of our mobile phones such as AR/VR, all are AI developments The product. AI also poses a very big challenge to the semiconductor industry, especially the production of high-performance and low-power chips required by AI. The boundaries between the manufacturing and packaging and testing processes of chip manufacturing are becoming increasingly blurred, and the need for system integration is emerging, and chiplets will soon become a reality. This trend will promote the entire semiconductor industry chain, from EDA tools to design, from equipment materials to manufacturing packaging and testing, into a new era. 2020 is also the beginning of this era.

Xu Linhua, Executive Vice President of Ningbo Silicon Electronics

Xu Linhua, Executive Deputy General Manager of Ningbo Silicon Electronics (Ningbo) Co., Ltd.

In the long history of the development of China's semiconductor industry, the upcoming 2019 will definitely leave a strong mark. In the context of the Sino-US game, in this battle without gunpowder, the semiconductor field in the high-tech industry has become the Shangganling on the battlefield, and Huawei has been defined by the United States as the primary target of precision strikes. History has always been like this. It seems that the mountains and rivers are exhausted, but in fact it is about to usher in the time when the will of the sky will be bright. Sure enough, under the guidance of the national industrial policy and the strong promotion of the “localization” trend of the industrial chain, 5G/pan-IOT/artificial intelligence and other highlights have exploded. In the second half of the year, China's integrated circuit industry is thriving and the market is in short supply. , The industry and capital developed rapidly, sweeping away the haze at the beginning of the year.
I remember that at the beginning of 2019, the general economic situation was overcast, the integrated circuit industry continued to decline, and the uncertainty about the future filled the industry with a certain degree of pessimism. At that moment, Yongxi Electronics had just been established for a year. Although it was full of hope for the industry's prospects and its own strength was beyond doubt, it was so difficult as a startup company. There is no turning back at the bow, and the Ningbo Silicon Electronics entrepreneurial team has firm confidence. The construction of SiP, BGA, QFN, MEMS high-end integrated circuit packaging and testing lines is moving forward. As of the end of 2019, the total annual investment exceeded 1.3 billion RMB, and the annual sales The amount has reached nearly 400 million RMB, and the single-month high-end integrated ceremony packaging and testing manufacturing production capacity has reached 180 million units, and the single-month sales have exceeded 70 million RMB. While the company has made great achievements, it has also made great contributions to the localization of the industrial chain.
Looking forward to 2020, the first golden decade of China's integrated circuit industry is still in its infancy. In our domestic customer base and application fields such as SoC, RF, PMIC, Sensor, etc., many heroes are serving the country as a technological power and industry. Struggling endlessly, I am often moved and excited about it. While realizing the two levels of team, personal material and spiritual pursuits, I believe that national rejuvenation and national prosperity will be just around the corner.
Yongxi has won the support of new and old friends in the industry and many customers. Therefore, we can only live up to the trust and love of our friends in the industry if we promise to be honest, work hard, and forge ahead! 2020 goal: customer satisfaction, doubling performance, Yongxi come on, let's cheer together!

Yu Daquan President of Yuntian Semiconductor

Yu Daquan, President of Xiamen Yuntian Semiconductor Technology Co., Ltd.

2019 marks the 70th anniversary of the founding of the People's Republic of China. The National Day military parade in the context of Sino-US frictions inspires, excites, and prides every Chinese.
2019 is a very critical year for the development of domestic semiconductors. The Sino-US trade war has begun to intensify, and it will gradually ease and reach an agreement by the end of the year. The entire domestic semiconductor industry has also moved from a bitter wind to a thriving. The escalation of friction in the global market makes us more clearly see that the core semiconductor technology must be in our own hands. The sanctions imposed by the United States on Huawei have accelerated the construction of a domestic independent industrial chain; Japan’s export ban on South Korea has shown us that core materials cannot be controlled by others. In 2019, the Science and Technology Innovation Board was born, and the second phase of the Big Fund was established, which will promote the rapid rise of the domestic chip industry chain.
With the advent of 5G applications, the market for RF front-end devices will soon reach more than 30 billion U.S. dollars, and my country's current market share is less than 5%, which is a huge gap. In view of the status quo that domestic RF front-end technology and industrialization are constrained by others, the domestic industry chain needs to carry out collaborative innovation in design, manufacturing, and packaging to solve the problem of stuck necks. In 2019, Xiamen Yuntian Semiconductor completed the construction of the R&D line and began to cooperate with domestic companies in the RF field to develop cooperative R&D and foundry services. In the face of many difficulties and challenges, the team has overcome them and overcome them. In the packaging and integration of 5G radio frequency devices, they have developed three-dimensional packaging technology for SAW filters, three-dimensional integration technology for glass through holes, and millimeter wave fan-out at 77GHz and above. Integration technology and high-Q inductance IPD integration technology. Among them, many technologies have reached the international leading level and have been continuously applied in customer products.
Looking forward to 2020, the development situation of the domestic semiconductor industry is vast. The demand for 5G applications is about to open the floodgates, and the battle for localization of radio frequency devices has entered a critical period. Follow the trend, integrate into the great torrent of national industrial development, grasp the rare opportunity for change, use our innovative technologies and products to better serve the RF front-end products, and contribute to the ecological and healthy development of the domestic 5G RF industry chain.

Zhang Yifeng CEO of Liyang Chip

Zhang Yifeng, CEO of Guangdong Liyang Chip Testing Co., Ltd.

The sun and the moon are surging, and the stars are listed. The cold is coming and going, the autumn is harvested and winter is hidden. The year of Jihai that is about to pass is really a year of ups and downs. With the once-in-decade cycle of the semiconductor industry chain, the industry as a whole started in a sorrow in the first quarter, accompanied by Sino-US trade frictions and bans throughout the year. , And the second elder brother who had soaring prices... In the end, due to comprehensive factors such as domestic substitution, the establishment of science and technology innovation boards, 5G commercial use, etc., they quickly walked out of the trough and ushered in an inflection point. Uplifting.
In 2019, domestic chip design industry-wide sales are expected to be 308.49 billion yuan, surpassing the 300 billion yuan mark for the first time, an increase of 19.7% from 2018's 257.70 billion yuan. It is expected to account for the largest share of global integrated circuit product sales revenue. More than 10% at a time. With the continuous investment of "National Integrated Circuit Development Outline", "Made in China 2025" and the second phase of the National Fund, the rise of China's core industry chain has become an irreversible trend.
Calculated based on the ratio of chip test accounting for 5-10% of chip cost, the test output value of domestic chips has reached RMB 15-30 billion. However, due to the serious shortage of domestic third-party professional chip testing capacity, chip testing is currently undertaken by the whole industry chain, and part of the testing has to be outsourced to overseas professional testing plants. With the advancement of localization, advanced technology products are becoming more and more dependent on testing. In the near future, we are bound to usher in a tens of billions of dollars in chip testing market, which urgently needs people of insight in the industry to participate in the grand event.
Founded in 2010, Liyang Chip is the largest professional testing solution provider for integrated circuit chips in China (domestic-funded). Its main business includes integrated circuit testing program development, wafer CP testing services, finished FT testing services, and integrated circuit Test related supporting services. Liyang Chip is a typical representative and loyal practitioner of "independent third-party test foundry" under the professional division of labor in the semiconductor industry. It undertakes the four core steps of design, manufacturing, packaging and testing in the integrated circuit industry chain. The first link is the key to complete testing and verification before chip delivery to terminal applications. The company focuses on being a goalkeeper for chip delivery on time with guaranteed quality and quantity. Liyang chips have the ability to develop custom test programs for Turnkey, which fully meets the testing needs of different application types of chips.
At the beginning of the establishment of the company, Liyang Chip took the lead in deploying 12-inch wafer scale test capacity, and realized mass production test of a number of leading chips in the industry segmentation field earlier, and has achieved mass production of more than 2,200 chip test solutions. There are more than 80 patent authorizations. The company continues to increase R&D investment and expand test capacity, accurately grasping the general trend of the localization of the chip industry and the hot opportunity of the explosive growth of blockchain chips, ushering in the opportunity of explosive vertical growth, and the previously planned production capacity has been fully utilized , With the industry's highest equipment efficiency to achieve an annual growth of more than 60%, and operating profit has increased several times.
In particular, the company's AI high computing power chip testing solution for the world's leading 7nm advanced technology, perfectly solves the problem of discrete chip yield caused by high-end process instability. The company directly participates in the development and customization of equipment, and creatively conducts multi-dimensional research on massive test big data, thereby continuously optimizing targeted dedicated test programs, guiding the adjustment of front-end wafer manufacturing and packaging processes, and adopting highly customized test programs. The indicators of large current, deep vector, and discrete performance parameters are effectively classified and screened to meet the scenarios where hundreds of chips are used in series power supply for terminal applications, and provide chip products with completely consistent performance such as leakage current, operating frequency and reliability. This makes this series of chips rise from a 50-80% fluctuating yield rate to an average yield rate of 99%.
The Gengzi reincarnation, the rat bites the sky. We are about to usher in the 1920s of the 21st century, and China's chip industry will also enter the 2.0 stage. First of all, we will see the changes in the business model. Based on the existing IDM and FOUNDRY foundry, the Chipless model has become a new force. Taking Huawei HiSilicon as an example, emerging design forces such as Ali Pingtou and Gree Zero Boundary will further erode the market share of the vertically integrated IDM model with the huge terminal demand and brand effect that the parent company has mastered. The second is the outbreak of the wearable market, which has found a new entrance for the Internet of Everything. TWS has already tried its best in 2019. Smart wearables may become the third core application that triggers the leap of the entire industry chain after computer PCs and mobile internet.
Looking ahead, China’s semiconductor industry is about to usher in the golden 15 years of continuous explosive growth. With the steady progress of the national strategy of chip localization, the new foundry will bring an increase of one million wafers of WAFER/M. Chip R&D and market promotion capabilities will continue to improve, and the huge test market of tens of billions of dollars will place higher demands on professional test companies.
2020 will also be an important year for Liyang Chip to reinvent and thrive. The company will strive to become a benchmark for the third-party professional testing industry in China! To benefit national brands, to promote the core of China. Liyang Chip is committed to revitalizing the national integrated circuit industry, creating a domestic first-class chip testing brand, and aspiring to become the world's largest semiconductor testing base. The company will always keep in mind its mission and focus on independent third-party integrated circuit testing and development. On the basis of maintaining the original superior testing platform, the company will further actively deploy high-end chip testing equipment, develop testing technology solutions, and improve team management capabilities and layout 5G, AI, IoT, MEMS, Automotive, Memory, RF, FPGA and other high-end chip test technology solutions, seize the irreversible trend of the localization of the chip industry, become bigger and stronger, and continue to help China Chip!

Author: core ideology
Link: https://xueqiu.com/7814068463/140103075
Source: Snowball
The copyright belongs to the author. For commercial reprints, please contact the author for authorization. For non-commercial reprints, please indicate the source.
Risk Warning: The opinions mentioned in this article only represent personal opinions, and the subject matter involved is not recommended. Buy and sell accordingly at your own risk.



Contact: Mr Liu

Phone: 18688779380

Tel: 18688779380

Email: eric.liu@feedlitech.com